Purpose: This setup is used to electrochemically etch the surface of copper, aluminum and other metals. Etching produces microstructures on the surface which improve the roughness of the surface. These sophisticated structures maybe used to enhance the boiling and evaporative heat transfer coefficients of the metals. These microstructured surfaces when functionalized with silanes may also enhance superhydrophobicity. Any metal may be etched in this setup by carefully selecting the electrolyte. The aspect ratio of the micro structures is determined by the rate of etching which is set using a DC power supply.